With the opening of generative AI applications and the development of various AI applications, server CPU and GPU performance have improved , heat dissipation issues have become hot topics one after another. However, with the rapid development of data centers, energy consumption and heat dissipation problems have become increasingly prominent. The use of cooling technology has become an inevitable choice to alleviate the energy consumption and heat dissipation problems of data centers.

        The ability of liquid to take away heat is a thousand times that of gas, but it can save considerable power consumption. As the demand for server computing power increases and countries require power usage efficiency under the sustainable development trend of ESG, the development of liquid cooling has become a general trend, among which immersion cooling technology has more advantages.

        Traditional air cooling uses air as the heat exchange medium, while liquid cooling data centers use deionized water or fluorinated water Liquids such as liquids are used as heat exchange media. Due to differences in density, specific heat capacity and thermal conductivity, the heat dissipation capacity of liquid with the same flow rate can be increased by up to 3500 times compared to air. According to the contact method between the coolant and the heat source, liquid cooling technology can be divided into two categories: non-contact liquid cooling and contact liquid cooling.

        The key to liquid cooling is the coolant, which must be able to absorb heat quickly, and in the process of vaporization and liquefaction It can carry out heat transfer very efficiently, and at the same time, it must be non-corrosive and not cause damage to machinery and equipment. Since the coolant is in complete contact with the server equipment, the requirements and characteristics of the coolant include:

• Permeability: low viscosity, extremely low surface tension, can penetrate small cracks, and has little viscosity change at low temperatures.
• Chemical properties: Excellent thermal conductivity, thermal stability, chemical stability.
• Drying properties: Moderate boiling point, low heat of vaporization during evaporation, fast evaporation rate, good drying properties, and short drying time.
• Recyclability: The steam slide can be regenerated and reused.
• Safety: High flash point and auto-ignition temperature.
• Environmental protection: colorless, odorless, non-toxic, ozone depletion potential (ODP) is 0, global warming potential (GWP) is low, and complies with environmental protection policies.
• Safety of use: Non-corrosive to structural materials (metals as well as polymers and other non-metals).

         The rapid rise of immersion liquid cooling technology in data centers has promoted the research and development and application of coolant, but the safety and environmental impact during use cannot be ignored. From a long-term application perspective, when laying out liquid cooling systems in data centers, they must not only carefully select the type of coolant based on the heat dissipation effect, but also based on operational safety and environmental considerations.

        Inductors in electronic equipment plays a vital role, but it also causes some problems. One of them is thermal management. In high-power applications, inductors generate a large amount of heat, which may cause the device to overheat if it cannot dissipate the heat effectively. , or even cause a malfunction. In order to solve this problem, in addition to traditional heat dissipation methods (such as attaching a heat sink to the inductor to increase its heat dissipation surface area or using a fan to increase air flow and accelerate the heat dissipation process), some new thermal management technologies have also begun to appear. For example, liquid cooling technology can dissipate heat by submersing the inductor in a coolant. This technology is widely used in some high-performance electronic devices because liquid cooling can provide higher heat dissipation efficiency.

         Thermal management is not just for inductors. All electronic devices require thermal management to ensure their normal operation. Therefore, thermal management should be taken into consideration when designing electronic devices.